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MCIMX6U5DVM10AC i.MX 6UltraLite 800MHz Cortex-A7 MPU 128KB L2 Cache 624-MAPBGA (21x21) -40°C to +105°C Industrial IoT Optimized

중국 TOP Electronic Industry Co., Ltd. 인증
중국 TOP Electronic Industry Co., Ltd. 인증
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—— 이탈리아Giancarlo 에서

제가 지금 온라인 채팅 해요

MCIMX6U5DVM10AC i.MX 6UltraLite 800MHz Cortex-A7 MPU 128KB L2 Cache 624-MAPBGA (21x21) -40°C to +105°C Industrial IoT Optimized

MCIMX6U5DVM10AC i.MX 6UltraLite 800MHz Cortex-A7 MPU 128KB L2 Cache 624-MAPBGA (21x21) -40°C to +105°C Industrial IoT Optimized
MCIMX6U5DVM10AC i.MX 6UltraLite 800MHz Cortex-A7 MPU 128KB L2 Cache 624-MAPBGA (21x21) -40°C to +105°C Industrial IoT Optimized MCIMX6U5DVM10AC i.MX 6UltraLite 800MHz Cortex-A7 MPU 128KB L2 Cache 624-MAPBGA (21x21) -40°C to +105°C Industrial IoT Optimized MCIMX6U5DVM10AC i.MX 6UltraLite 800MHz Cortex-A7 MPU 128KB L2 Cache 624-MAPBGA (21x21) -40°C to +105°C Industrial IoT Optimized MCIMX6U5DVM10AC i.MX 6UltraLite 800MHz Cortex-A7 MPU 128KB L2 Cache 624-MAPBGA (21x21) -40°C to +105°C Industrial IoT Optimized

큰 이미지 :  MCIMX6U5DVM10AC i.MX 6UltraLite 800MHz Cortex-A7 MPU 128KB L2 Cache 624-MAPBGA (21x21) -40°C to +105°C Industrial IoT Optimized

제품 상세 정보:
Place of Origin: China
브랜드 이름: NXP
인증: CE, GCF, ROHS
Model Number: MCIMX6U5DVM10AC
결제 및 배송 조건:
Minimum Order Quantity: 1
가격: negotiable
Packaging Details: Packed in original tray firstly ,then carton, at last Bubble bag for outer packing
Delivery Time: 3-5 working days after received the payment
Payment Terms: T/T, Western Union,
Supply Ability: 1000pcs per month
상세 제품 설명
Packaging Type: Reel Tray Tube Tape Bag Operating Temperature: -40°C ~ 125°C
Package / Case: WSON-8 Mounting Type: SMD/SMT
Manufacturing Date Code: 2024+ Function: Step-Down

MCIMX6U5DVM10AC

 

Introduction

The i.MX 6Solo/6DualLite automotive and infotainment processors represent the latest achievement in integrated multimedia-focused products offering high-performance processing with a high degree of functional integration. These processors are designed considering the needs of the growing automotive infotainment, telematics, HMI, and display-based cluster markets.

The processors feature advanced implementation of single/dual Arm®Cortex®-A9 core, which operates at speeds of up to 1GHz. They include 2D and 3D graphics processors, 1080p video processing, and integrated power management. Each processor provides a 32/64-bit DDR3/DDR3L/LPDDR2-800 memory interface and a number of other interfaces for connecting peripherals, such as WLAN, Bluetooth®, GPS, hard drive, displays, and camera sensors.

 

application

• Automotive navigation and entertainment

• Graphics rendering for Human Machine Interfaces (HMI)

• High-performance speech processing with large databases

• Audio playback

• Video processing and display

 

Characteristics

• Multilevel memory system—The multilevel memory system of each processor is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The processors support many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed NAND, including eMMC up to rev 4.4/4.41.

• Smart speed technology—The processors have power management throughout the IC that enables the rich suite of multimedia features and peripherals to consume minimum power in both active and various low power modes. Smart speed technology enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations.

• Dynamic voltage and frequency scaling—The processors improve the power efficiency of devices by scaling the voltage and frequency to optimize performance.

• Multimedia powerhouse—The multimedia performance of each processor is enhanced by a multilevel cache system, NEON™ MPE (Media Processor Engine) co-processor, a multi-standard hardware video codec, an image processing unit (IPU), a programmable smart DMA (SDMA) controller, and an asynchronous sample rate converter.

• Powerful graphics acceleration—Each processor provides two independent, integrated graphics processing units: an OpenGL® ES 2.0 3D graphics accelerator with a shader and a 2D graphics accelerator.

• Interface flexibility—Each processor supports connections to a variety of interfaces: LCD controller for up to two displays (including parallel display, HDMI1.4, MIPI display, and LVDS display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host and other), 10/100/1000 Mbps Gigabit Ethernet controller two CAN ports, ESAI audio interface, and a variety of other popular interfaces (such as UART, I2C, and I2S serial audio, and PCIe-II).

• Automotive environment support—Each processor includes interfaces, such as two CAN ports, an MLB150/50 port, an ESAI audio interface, and an asynchronous sample rate converter for multichannel/multisource audio.

• Advanced security—The processors deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the i.MX 6Solo/6DualLite Security Reference Manual (IMX6DQ6SDLSRM).

• Integrated power management—The processors integrate linear regulators and internally generate voltage levels for different domains. This significantly simplifies system power management structure.

 

Information

Category
Manufacturer
NXP USA Inc.
Series
Packaging
Tray 
Part Status
Active
Core Processor
ARM® Cortex®-A9
Number of Cores/Bus Width
2 Core, 32-Bit
Speed
1.0GHz
Co-Processors/DSP
Multimedia; NEON™ SIMD
RAM Controllers
LPDDR2, LVDDR3, DDR3
Graphics Acceleration
Yes
Display & Interface Controllers
Keypad, LCD
Ethernet
10/100/1000Mbps (1)
SATA
-
USB
USB 2.0 + PHY (4)
Voltage - I/O
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature
0°C ~ 95°C (TJ)
Security Features
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type
Surface Mount
Package / Case
624-LFBGA
Supplier Device Package
624-MAPBGA (21x21)
Additional Interfaces
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Base Product Number

 

Drawing

MCIMX6U5DVM10AC i.MX 6UltraLite 800MHz Cortex-A7 MPU 128KB L2 Cache 624-MAPBGA (21x21) -40°C to +105°C Industrial IoT Optimized 0

Our advantage :

  • High quality products --- our offers are 100% new and original, ROHS
  • Competitive price --- good Purchase channels with good price.
  • Professional service --- strict quality testing before the shipment, and perfect after-sales service after the purchase.
  • Adequate inventory --- With the support of our strong Purchasing team,
  • Fast delivery --- we will ship the goods within 1-3 working days after the payment confirmed.

 

be sure to meet your need for all kinds of components. ^_^


Product List
Supply a Series of Electronic Components, full range of semiconductors, active & passive Components.We can help you to get all for bom of the PCB,IN a word, you can get one-stop solution here,


The offers including:
Integrated Circuit, Memory ICs, Diode, Transistor , Capacitor, Resistor, Varistor, Fuse, Trimmer & Potentiometer, Transformer, Battery, Cable, Relay, Switch, Connector, Terminal Block, Crystal & Oscillator, Inductor, Sensor, Transformer, IGBT Driver, LED,LCD, Convertor, PCB (Printed Circuit Board),PCBA (PCB Assembly)

Strong in Brand:
Microchip, MAX, AD, TI, ATMEL, ST, ON, NS, Intersil, Winbond, Vishay, ISSI, Infineon, NEC, FAIRCHILD, OMRON,YAGEO, TDK, etc

연락처 세부 사항
TOP Electronic Industry Co., Ltd.

담당자: Mrs. Natasha

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